Archive for the 'Business' Category

Strategy in today’s smart phone & tablet market

Saturday, June 25th, 2011

On a recent flight to Penang (a biz trip and not a vacation!), I was thumbing through a special edition of HBR – Essential reads for Global leaders” and came across this interesting and old HBR article “What is Strategy?” by Michel Porter. While this was published in HBR Nov-Dec 1996 issue, it reflected so much of today’s biz world, especially the hot competition amongst the smart phone and now the tablet vendors that I wanted to share it here.

First the article outlines the difference between Operational Excellence (OE) and Strategy – something that is so often confused in today’s biz arena. OE means performing similar activities better than rivals. Strategy is the creation of a unique and a valuable position, involving a different set of activities. It is creating a fit among its activities. The essence of strategy is not just of what and how to do but very much of what NOT to do.

Some statements from the article, which resonate so well in today’s market of smart phones and tablets –

“Gradually managers have let operational effectiveness supplant strategy resulting into zero-sum competition, static or declining prices ad cost pressures”

Take the example of Mediatek. By providing a cheap reference design and a complete system, it became a game changer for the shanzhai market in China. However, this was more of an OE coupled with targeting the right market. With Spreadtrum making inroads in the same space at even more competitive prices, Mediatek is now losing ground to such rivals and is tweaking its strategy.

“Competitive convergence is one reason why OE is insufficient. As rivals imitate one another’s improvements in quality, cycle times, or supplier partnerships, strategies converge and competition becomes a series of races down identical paths that no one can win”

“Strategic fit among activities is fundamental. It is harder for a rival to match an array of interlocked activities than it is merely to match a process technology or replicate a set of product features” – Now is this not exactly what Apple is doing (user experience pervades all activities within the company. Everything Apple does just re-enforces this and it has a close end-to-end system to ensure this)? The others are following it with a “me-too” approach, which can provide an explosive growth for an interim but not last long.

On approaches to preserve growth and re-enforce strategy – “One approach is to look for extensions of the strategy that leverage the existing activity system”

I look at RIM and its foray into tablets with Playbook here. RIM’s strength with its Blackberry phones has been enterprise. Analysts attribute RIM’s decreasing influence to the growing trend of CIO’s decisions on smart devices to be used by the enterprise employees as being increasingly based on what the employee uses as a consumer – thus skewing it away from the enterprise world which had always been RIM’s strength and essential to its strategy.

But then look at it from another perspective. Tablets are not just being used as a general consumer product – for the consumer to be connected. It has a tremendous potential (and is already being used thus) for enterprise productivity. RIM needs to see how to connect or rather leverage on this fit and communicate the strategy better to the customers who value this enterprise productivity.

India’s latest fab push

Monday, April 25th, 2011

Setting up fabs has been a point/initiative that keeps popping in and out in the Indian semicon landscape; and has been happening ever since India’s main fab (SCL) in Mohali had a major fire in late ‘80s!
(incidentally STMicro and IME/S’pore owe a lot to that as the SCL employees moved to these and other pastures following the fire!)

As mentioned in the article, a couple of years back the fab initiative again got some major push courtesy SemIndia as well as Hindustan Semiconductor Manufacturing Corp/Infineon combo but never took off.

While there are several proponents for building semicon fabs in India, personally I am not too gung-ho about the same J, mainly because

·        India does not have the apt environment and infrastructure needed for a fab (these fabs can help a lot on the local employment scene, though)

·        Fabs are too costly to be handled by small players. I do not see the big ones entering here in India w/o being incentivized by sizeable subsidies/tax breaks from the govt.  Intel was an interested player (though I think for backend fab) but the govt. and the tech bellwether could not come to anything mutually beneficial.
·        Even if the fab comes, the technology produced is another question. Are we talking about the low end technos (how will that develop “localized content and value-addition to the Indian made electronic products”?) or the high end ones (which IDM/foundry will opt for this?)
·        With fabs increasingly being seen as only a big players’ game (or of a consortium of big players) and IDMs going fab-lite, there is not much fiscal sense in pushing for a domestic fab in India. Even strategically (long term), it is a too high cost game for new players. However, should it be for some analog process (which generically trails behind the digital ones), it may make sense – will TI be interested (it already has a big R&D set-up in India)
 

 ·       I personally see hardware morphing into a diminishing role in the electronic products – software (embedded as well as application) is growing into a differentiating niche. India can leverage its strengths in embedded design, software development and large domestic market to attract the big global players further and climb up further in the value-chain. It has already been doing so (moving from routine tasks outsourced from the global HQs to local offices to chip development and now slowly on to system development)

 Domestic fabs can spawn the right eco-system to catalyse India into a big player but right now the odds are too much stacked against it – and am not sure if the projected gains are sufficient to warrant this path….

Oracle vs. HP and Intel’s Itanium – a semiconductor perspective

Sunday, April 24th, 2011

Recently a friend mentioned about the tremendous impact on Intel from Oracle’s March 22 announcement of its discontinuing development on Itanium.

While I had known about this announcement, I had not really given it much thought from the semiconductor perspective. So when I heard this comment, I started digging up…!

A bit on the background first: Using an architecture (based on explicit instruction level parallelism - in which the compiler decides which instructions to execute in parallel; as opposed to the superscalar architectures in which the processor manages the instructions dependencies at run time) that originated at HP and was later jointly developed along with Intel, Itanium is a family of 64-bit Intel microprocessors. The architecture was formerly called IA-64.

By 2009, the chip was almost entirely deployed on servers made by HP, which had over 95% of the Itanium server market share making HP-UX the main operating system for Itanium.

Ironically, the hardware competition to Intel’s Itanium comes from a chip from its own stables – the Xeon (Intel’s response to AMD’s x86-64 Opteron in 2004) that has cranked up its market share in the server pie over the years.

In comparison with its Xeon family of server processors, Itanium has never been a high-volume product for Intel. Majority of Intel’s server business is x86 and it will in the end suffer only a token loss of revenue as a result of Oracle’s announcement. Itanium has become such a niche product for Intel that the announcement had little effect on the chipmaker’s stock - Intel shares were up .02%, to $20.15 the morning after.

Here are some figures:

In the fourth quarter 2010, both Gartner and IDC saw x86 server revenues grow more than 20 percent. According to Intel (which cites figures by IDC), revenues of Itanium-based servers was $4 billion in 2010. By contrast, x86-based server sales was around $33.3 billion in 2010. With the x86 server market being eight times larger than that of Itanium, it does not make much sense for Intel to invest into Itanium’s development. On the other hand, it also cannot simply ignore the $4B Itanium market especially with the fact that the sockets for Itanium and Xeon are NOT interchangeable – as yet. Intel shared some information and re-iterated its commitment on the Itanium roadmap this month.

Btw, Intel recently announced 2 more server makers into its Itanium roster: Huawei Technologies and Inspur – that’s a 50 per cent growth rate in the Itanium OEM base.

IC Insight’s revised capex forecast

Wednesday, April 13th, 2011

IC Insights revised its capex forecast last week in which they indicate that semiconductor industry capital spending is projected to grow to $60.4 billion in 2011, up 17 percent from $51.8 billion in 2010,

I had done some number chewing from the earlier (Jan) report in a previous blog. So was curious to look at the changes. Looks like a couple of big ones in this revised one from the previous (Jan ‘11) forecasts - and they are for ST and Sandisk.

ST’s is 100% (from Jan’s 750M$ to April’s 1500M$) and Sandisk’s is 77.7% (from Jan’s 900M$ to April’s 1600M$). TSMC’s % change from previous is 23.8% increase.

Sandisk had already reiterated its 2011 capex budget of $1.4-$1.6 bn in Feb’11 and IC Insights’ new table reflects that (where did the earlier figure of 900M$ come from??). ST had also announced its capex plans ($1.1 -$1.5b) in as early as late Jan ‘11 (reflected in IC Insights’ latest table)

Japan quake and the semiconductor supply chain

Tuesday, April 12th, 2011

The infrastructure (transport, power etc.) disruption has indeed caused problems to the supply chain. The effect is not so immediate due to the inventory stock available with most customers. People here in Singapore while worried do not generally anticipate much problem in the semicon supply chain. Most of the companies here have enough inventory to last at least the next one to two months. In the meantime, they are exploring how to diversify their supply chain as well. Japan has however, is still experiencing aftershocks.

Having said that, I think that it will be the electronics supply chain (as compared to the semiconductor one) which will be more impacted. Japan is a big player in consumer electronics but not necessarily in semiconductors. (It accounted for 13.9$% of 2010’s global electronic equipment revenue and 16.5% of consumer electronics). Plus other than a TI fab, most others escaped damage.

But as Japan is the world’s largest supplier of silicon, raw wafer inventory will soon get depleted.
The infrastructure disruption is likely to cause short supply and higher ASPs (analysts foresee higher than expected global semicon revenue).  Affected parts are likely to include NAND flash, DRAM, microc, LCD panels and parts.

In fact on the electronics supply chain (a smooth semicon chain will not be of much help with a disrupted electronic one!), there was a recent interesting article in WSJ reporting a possible delay in iPod production because of the shuttering of a polymer (called PVDF and being used as a binder in batteries) manufacturing facility, owned by Kureha (it holds 70% of the PVDF market)., near the Japanese earthquake’s epicenter.  Reminds me of the old adage – for want of a nail, the battle was lost…

Analyzing some figures from “5 IC makers join $3B capex club”

Sunday, January 23rd, 2011

Analyzing some figures from “5 IC makers join $3B capex club”…..

Taking just the top 4 spenders and UMC -

Samsung made a quantum jump in total capital spending from $3.5B in ’09 to $9.6B in’10 – a 173% increase, It was the top spender in chip capex in ’10 (interestingly it’s ’10 capital spending was not too less than the combined cap spending of the next two entries in the list - Intel and TSMC). It’s ’11 forecast of $9.2B is a 4% dip from its ’10 spending – making it figure at the bottom of the 2011 major spenders ranked by forecasted spending change from the previous year. The absolute forecasted amount for ’11 is, though, still slightly higher than Intel’s $9B. However Samsung is known to outspend its target every year and analysts still predict a %-10% industry capex outlook.

The company is also cutting down on its DRAM spending. While overall semiconductor spending budget change is forecasted as 0% this year, the foundry spending is up (double of ’10) – still at record levels. Another interesting point to note is that in ’10 (a year in which % change in its capital spending from the previous year was a good 173%), Samsung’s capex/sales ratio (~38% with 9.6B capex and $25B sale, as estimated in mid ’10) was not too far off from its long term average of 32%.

Coming to Intel - Intel’s capex spending in ’10 was much less than Samsung for the same year ($5.2B vs. Samsung’s $9.6B) but is forecasted to be a massive one (73%) this year. However as pointed our earlier, the ’11 forecasted absolute amount will be slightly less than Samsung’s. This comes after a year which Intel called a record year and its best year. Major reasons cited for the industry bellwether’s increased capex in ’11 are - 22nm transition and expected increase in demand. Intel is approaching 22nm transition in ’11 and it also sees tremendous growth opportunities this year, especially with Atom based SoCs in smartphones, tablets, smart devices etc. as well as PC& server segments. Plus, it should not be forgotten that Intel is growing from 3 high volume leading edge fabs to 4.

Next the world’s top pure-play foundry – TSMC made major investment in’10 - a 120% ‘09/’10 % change amounting to $5.9B – slightly higher than Intel and much less than Samsung. However, the table indicates only a marginal forecasted ‘11/’10 % change – 7%, absolute sum of $6.3B. Note, though, that this is the highest absolute sum forecasted amongst all foundries.

Besides capacity, TSMC has always focused on being the technology leader amongst all the foundries. Recent news items point to TSMC’s high R&D spending in ’10 (the company’s R&D spending rose by 44% to reach $945M – moving it into the top 10 in R&D spending - and making it the first pure-play foundry to move into the top 10 semiconductor R&D spending club. TSMC hopes to catch a bigger share of the 28nm market this year.

Coming to GlobalFoundries – The y-o-y % changes are quantum (490% - ‘09/’10 and 96% - ‘11/’10) but then look at the starting point in ’09 - $466m which is quite low compared to TSMC and less than UMC’s too for that year – it had a lot of catching up to do. The foundry is in the process of expanding its current facilities (leading edge facility in Dresden/Germany), building the new manufacturing facility in NY and financing another production facility that will be located in Abu Dhabi.

The expansion focus in Dresden facility will be on adding new capacity to support additional growth opportunities for 45/40/28nm technologies as well as initial 22nm development. Target is to scale output to up to 80 thousand wafers/month over the next two years. The company has also been expanding its Fab 7 in Singapore to reach 50 thousand wafers/month across technologies ranging from 65nm to 40nm. GF’s 300mm output will be around 90 thousand wafers/month when all the new expanded facilities become fully operational.

Things are not looking too well for UMC – it started with a slightly higher capex than GF in ’09, spent half of GF’s (‘10/’09 % change) amount in capital in ’10 and is forecasted to keep the same capital spending in ’11. It could not catch up with TSMC especially on the technology front and now looks to be losing out to GF too. On a brighter note, UMC is reported to put CMOS –MEMS devices into volume production in 2011.

All these point to an intensification of competition on the foundry market as well as a rapid expansion of the contract manufacturers. The question is – will the industry see a foundry capacity glut in late 2011??

Intel invests $1b for A&T plant in Vietnam

Wednesday, November 3rd, 2010

An emerging “China plus one” strategy for companies looking to diversify from China is a good sign for Vietnam which had seen some roadblocks on its path to a hi-tech industry satellite (if not hub) last year when Intel as well as homegrown V-Caps had stalled their operations there. Countries like Vietnam hope to peel away a significant amount of tech business to become global subsidiaries of the world’s factory floor.

The industry bellwethers’ decision in 2006 to build an assembly & testing plant in a country without a single world-class university and instead of in countries like India and China jolted the global tech world.

Intel has always gone for geographical locations where the local government offers them major tax incentives and subsidies. Labour and other infrastructure costs, while important, do not weigh as heavily in the company’s plant location choice. In this respect, Vietnam gave Intel a virtual hot line to top government officials. Rick Howarth, Intel’s general manager of the 115-acre site in the new Saigon Hi-Tech Park, has reportedly an open invitation to visit the country’s top leaders any time.

However, this new investment in Vietnam does in no way signify the company’s move away from China. No one can ignore the huge customer base there. In fact, besides its existing big presence in China, Intel’s CEO, Otellini, attended the opening of Intel’s first microprocessor manufacturing facility in Dalian, China earlier in the week.

Becoming global subsidiaries of the world’s factory floor…

Percello’s acquisition by Broadcom

Friday, October 29th, 2010

Broadcom has paid $86m net of cash for Israeli femtocell IC specialist Percello in a bid to lower the BOM, and accelerate time to market, for its femtocell chip offerings. This comes close on the heels of acquiring the WiMAX prpovder, Beceem Communications.

The big fabless company’s acquisition does signify an endorsing of a real demand for femtocells. It is also now well positioned to take advantage of the relationship Percello has already cultivated with Ubiquisys, probably the number one in femtocell access point vendors.

Linley Gwennap, founder and principal analyst at Linley Group had correctly predicted in a talk to EETimes earlier -“The incremental cost of the femto function would be around $10. This could ultimately require the femto processor to integrate Ethernet and Wi-Fi as well as DSL or cable-modem. Broadcom is the obvious company to develop such a chip.”

Interconnectivity is getting more and more interesting! And hey, this is Broadcom’s sixth acquisition in Israel – and it already has 3 development centres there.

GlobalFoundries invests $3b to expand capacity

Thursday, June 3rd, 2010

News is aplenty of heavy capital investments being done. TI, in April, said that it would double the capacity of its 300mm analog fabs (as I said in my earlier blog - after off-loading its wireless products, it has to expand capacity for analog significantly in order to maintain growth momentum). Then the pure-play foundry world leader, TSMC, approved a capex expansion of $1.65 billion for 2010, followed by the Korean giant, Samsung Electronics announcing that it is investing a whopping $22.6b in capex and R&D. And now joining the other major chip companies seeking to ramp manufacturing production to exploit the recovery in global demand, we have the Abu Dhabi government backed GlobalFoundries planning to spend $3b on expansion.  The previous plan was for it to spend $2.5b on capex in 2010.  Abu Dhabi has pledged to spend about $10 billion to build up GlobalFoundries as a world-class competitor in the foundry business

All this sounds good for the industry which had seen some trough points in the last year and a half.  However, the timescales in semiconductor production for planned expenditures to translate into additional capacity is long enough for the industry to move into price decline because of over capacity.

UMC seeks funds

Tuesday, May 25th, 2010

Once the number 2 pure-play foundry in the world, UMC now lags behind TSMC, Samsung and GlobalFoundries in process technology.

The Taiwanese foundry is open to involvement from any strategic partner through private placement of 10% of its total shares or about $400 million for capacity expansion.. TI, ASML and GlobalFoundries are among the potential investors for the placement. GlobalFoundries has a major fab under construction in NY and is eager to add capacity; which can be achieved if it taps UMC. In fact, earlier in the year, it was rumored that ATIC approached UMC with a view to take a stake in it and secure additional production capacity.  A strategic partnership between the two would allow them to better compete with market leader TSMC.
 

Only the big can survive in this foundry biz. Consolidation will happen. The question is when and who will be the last few standing.

ARM’s foray into the server market

Tuesday, May 11th, 2010

Coming close on the heels of ARM’s CEO, Warren East’s remark that ARM based servers will be out in the market in the next 12 months,  comes news from Marvell – the fabless company aims to supply silicon for ARM-based servers with 40-nm multi core processors that it will ship this year. As per EE Times, Marvell and ARM are working with “multiple Tier 1 companies” to build larger trial deployments to validate ARM as a server platform. Separately, Marvell has opened up its dual-core architecture, drivers and board support package so partners can create server software needed to support the new market initiative”

Opinions about ARM’s foray into server market making a dent in Intel’s server biz vary. ARM’s marketing chief, Ian Drew recently pointed out that “We’re an [intellectual property] company — we learned in last two years that we don’t know everything about everything. On the servers, it will take longer than we imagine because it’s a much more complex problem [than smartbooks or phones]”. ARM is running one of its websites (for the ARM Linux Internet Platform) on a cluster of ARM based chips, part of a handful of experiments to test out the viability of using its chip architecture in severs. They are Marvel based.
 

The server market, long dominated by Intel, has lately seen increasing power concerns. Google’s recent acquisition, Agnilux, was rumored to be making servers with ARM architecture. TI is researching the use of DSPs in servers. Intel’s best hope can lie in working along with companies using its low power Atom chips to build power efficient servers.
 

“East wasn’t willing to name the chip foundries that ARM is working with, however he said that information should tip up in the next 12 months.” Now if one of these foundries happens to be GlobalFoundries, it’d be interesting to see how the server market pans out – Intel’s long term rival, AMD and Global Foundries share the same parent company.

Analysts bump up their forecasts with “blowout” Q1

Friday, May 7th, 2010

Q1 has been good for the semiconductor industry. Very good, especially w.r.t the dismal 2009.

With Q1 results ranging from knock out to good and promising, industry analysts (iSuppli, Future Horizons etc.) are also revising up their forecasts. The average forecast points north of 30. iSuppli noted that even though semicon revenues typically declines in the first quarter (compared to forth quarter of previous year), Q1’ 2010 saw chip sales up 1..1% compared with Q4 ’09.  Malcolm Penn of Future Horizons has been quite bullish. While cautioning about the potential for a second dip in the general economy, he maintained that only a monumental disaster of a scale similar to the banking crisis of 2008 could now derail the chip market recovery.

However, companies are still treading warily and hesitant to ramp up capacities – there is not much sign of the supply chain easing up.

Shortages hit LCD Driver IC

Thursday, May 6th, 2010

Close on the heels of analog chip shortages, comes the LCD driver IC one.
While there is a high demand for LCDs (used in notebooks, desktop PCs and cellular phones), chip makers are reluctant to add capacity – the older, high voltage and older technologies used for making them are considered unprofitable.
Companies are going in for alternate options – Samsung and Toshiba has paired up with Toshiba to start production of a “common-type” driver for 256-color super-twisted nematic LCD drivers and Samsung to produce the complementary “segment-type” driver. NEC, a leading driver supplier, is outsourcing to Sanyo Electric.   

Analog IC market - a sellers market for 2010

Thursday, May 6th, 2010

The tight supply of analog ICs seems set to continue. The current demand is growing faster than the capacity ramp ups and quite a few analog vendors are turning away business. 

Analog chip makers are struggling with part shortages and extended lead times. Further investments for capacity ramp-up, optimizing fab outputs etc. are taking place in an uncertain backdrop of a “relatively accurate picture of actual demand”.  TI is expanding its 300mm analog fab – though, after off-loading its wireless products, it has to expand capacity for analog significantly in order to maintain growth momentum. Maxim is taking several actions – optimizing existing production lines and increasing loading to foundry partner, Epson.  The analog IC market in particular looks to be a seller’s market for the entire 2010!   

 

Evolving face of EDA

Friday, December 11th, 2009

There has been a lot of talk recently over the blogosphere (& elsewhere!) about the changing face of EDA, EDA is doomed, EDA needs to change its biz model in order to survive etc.
What needs to be kept in perspective is the evolving value-proposition & risk sharing perceived by the chip designing company from an EDA vendor’s offering; especially in these times of the escalating costs (and diminishing success rates) of  chip designs in the higher technos.
I see the following path for the EDA vendors

  • EDA vendors’ offering to be more service oriented and I do not mean tool based trouble shooting here.  

  • Point tools across EDA vendors are losing their differentiation but are essential for basic design flow. I do not see chip vendors getting into developing these.  

  • EDA vendors will partner for point tools. These tools will evolve as per market requirements and be available on a pay-per-use model and bolstered by cloud computing.  

  • As a service, EDA vendors will closely work with the chip developers to see the project from specs to manufacturing. This is the service part of the tool+ service offering of the EDA vendors. The major chunk of the EDA vendor’s revenue will come from this service part and this will be the deciding criteria for the EDA vendors’ ranking in the chip designing world.  

Recommend a couple of interesting articles

What EDA needs to do to start growing again and Cadence goes two-dimensional

 

Who drives the car??

Wednesday, October 21st, 2009

Read an interesting article in the latest edition (Oct 26) of Fortune magazine. It is “An App store for autos?” written by Michael V. Copeland.

Michael writes that car’s dashboards should take a cue from iPhone. Car is the ultimate mobile device and automakers need to start acting more like consumer electronics companies if they do not want to cede one of their last great opportunities to Apple, RIM or Google. It would be interesting to have car appropriate applications, something akin to iTunes??

In fact, the writer talks about a driver less car – a team of computer scientists in Stanford University were given a Passat Wagon by Volswagen and they turned it into a driver less car – done by a series of sensors, navigation system and programming.

Reminds me of a management workshop which I attended more than a decade back while I was working with STMicro. The facilitator was talking about the various gizmos in the futuristic car when some one popped the question: Amongst all these gizmos and entertainment, who drives the car?? Well, the answer’s here now!!

Fab allocation back on the agenda

Tuesday, October 20th, 2009

As mentioned by Malcolm Penn of Future Horizons in the IEF 2009, “The ‘A’ word is back on the agenda”,
 

But it is not all smooth sailing for the foundry biz. The semiconductor industry’s capex has hit alarmingly low levels. The normal ratio of capex to sales over the industry’s history is 20%. Last year it was 12% and this year it will be 4%. The industry’s overall capacity is now 14% less than it was in Q3.’08. With the economy and market’s forecasted recovery, foundries will be hard pressed next year to meet the demands.
 

And that is where the “C” word comes in – Collaboration and Consolidation.
 

There has also been a lot of talk on consolidation in the foundry biz – as in other areas of the semiconductor industry. There are some pending mergers - between Hua Hong NEC and Grace Semiconductor; Tower Semiconductor’s 2008 purchase of Jazz Semiconductor, proposed acquisition of HeJian Technologies by UMC and the recent purchase of Chartered by GlobalFoundries.
 

Possible future mergers are: SMIC acquiring Cension Semiconductor Manufacturing International and Wuhan Xinxin Semiconductor Manufacturing - two companies which SMIC is managing. And then there are small foundries like Silterra, Altis and Landshunt which are struggling and open to speculation regarding a merger with another manufacturer.”
In all likelihood, as cited by iSuppli, there may be 3 major pure-play foundries left standing after the consolidation – TSMC, UMC and GlobalFoundries.

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Intel teams up with TSMC for Atom

Tuesday, March 3rd, 2009

Intel will port unspecified Atom processor cores to TSMC’s technology platform, including processes, IP, libraries and design flows under the terms of an agreement between the two companies announced yesterday.
 

The deal will expand the TAM for Atom. It allows TSMC & Intel to go after newer market segments together - namely the embedded, CE, netbooks and handheld market.

Some interesting highlights on this deal:

  • It is indeed a rare event for Intel to allow its processor to be manufactured by another company.
  • Intel has no plans to license or transfer its high-k process to TSMC. It is doubtful the TSMC Atom devices will include high-k and metal gates. Hence it’s unlikely that the core from TSMC will have the same performance level as that from Intel.
  • With PC shipments failing, Intel needs to aggressively penetrate into other markets.
  • Intel goes head-on with leading embedded core provider, ARM. While ARM is trying to move to larger devices (from handsets etc.) for its cores, Intel is moving in the opposite direction (PC to smaller devices)
  • We may see two strong foundry-IP camps emerging: ARM-IBM alliance and Intel-TSMC for the much sought after mid size converging devices in the embedded space.
  • Point to be noted is that while there are 2 different market segments for the processor – higher end processors for PCs and the lower (& cheaper ones) for MIDs, Intel will need to do a real balancing act here so as not to have its profits from the upper segment being eaten away substantially by the lesser profits of the lower end processors.

 

Synopsys, Magma eye opportunities in solar market

Friday, August 29th, 2008

The solar industry challenged semiconductor equipment manufacturers during the Photon Technology show in Munich in April this year, to better address their needs. While in the past, they had to make do with equipment originally developed for the semicon industry, they are pushing the equipment suppliers to build specifically for them.

Looks like, not only the equipment and yield management solutions/services vendors (like KLA-Tencor, Applied Materials etc.), but also the EDA vendors are jumping on this bandwagon; in the process also attempting to improve their bottom line by leveraging from this rapidly growing industry; especially important in times when the forecasts for the semicon industry do not appear too rosy.

With limited resources and the present state of economy, hope this does not come at the cost of inadequately addressed solutions to UDSM design related challenges.

Designed in China: Domestically conceived chip market booms in nation

Wednesday, August 20th, 2008

The story is familiar – Foreign companies come into a country to tap into its low cost labour. Sooner or later the low cost factor erodes and those foreign companies move out to newer pastures.

This is what also happened to the semiconductor industry in China. Foreign electronic equipment manufacturers come to tap into its relatively low cost labour. With the global economy going south, they decelerate the pace of their manufacturing outsourcing to China resulting into negative impact of the country. However, this negative impact has partially been off-set by a transformation in the country wherein there is now an increased focus on designing chips for electronic products that are popular in the nation - and thus tapping its own vast domestic market.

Demand for these locally designed chips is being driven mainly by China and Hong Kong-based electronics OEMs and contract manufacturers with foreign ODMs that develop and manufacture goods for Chinese OEMs also chipping in.

The initial manufacturing outsourcing to China had resulted into a large number of local design houses – they are now tapping the domestic market.

The largest application for Chinese designed semiconductors in 2007 was Mobile handsets followed by notebook PCs. But the fastest growing segment for domestically designed semiconductors over the next few years will be mobile communications infrastructure equipment - not surprising as the country is home to two of teh world’s bigger players i.e. Huawei and ZTE who incidentally are aggresively targetting the international markets for their growth.